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[EXHIBITOR] Jiangsu Mengde New materials Technology Co.,Ltd.
SF EXPO 2021
Addtime:2021-2-5

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Jiangsu Mengde New materials Technology Co.,Ltd.

Booth No. 1626

http://www.chinamengde.com/


Company Profile

Jiangsu Mengde New materials Technology Co.,Ltd., founded in 1996, is a new & hi-tech enterprise engaged in the R&D, production and sales of electrochemistry, new energy resource chemistry and biochemistry and relevant special chemicals, and has qualified for ISO9001:2008 certification of quality management system.

Based on the development for years, Mengde has succeeded in research and manufacture of over one hundred kinds of electroplating chemicals and various new-type electroplating processes, and holds a leading position in the intermediate domain as acid copper plating and nickel plating, etc, including the wide application of derivatives of the 1,3-propanesultone, alkynol and MDG polyethyleneimine in electroplating industry. In the aspect of new resources, it dedicates to the R&D and production of electrolyte additive for Li-ion battery, so as to enhance the lifetime and safety of Li-ion battery.

At present, the Company has a number of senior technical talents and several top testing instruments, and has established the good cooperation with many colleges and universities of China. We believe that the high quality of products and the trust of customers come from our constantly scientific management and unremitting innovative spirit.


Exhibits

Sodium polydithiolane sulfonate  (SPS)


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SPS is a kind of high content SP, which can be used as brightener for acidic copper plating instead of SP to obtain decorative and functional coatings. SPS can be used in combination with typical copper plating formulations, such as non-ionic surfactants, polyamines and other sulfur compounds, and can also be used in combination with dyes, resulting in better coating effect.


SLP high performance circuit board (PCB) acid copper migration agent


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SLP has excellent ability of filling and moving in low area. As an intermediate of acid copper, SLP is usually used as additive for acid copper plating on circuit board.


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[Print]

 China Electroplating Association

 China Surface Engineering Association Painting of Branch

 Chongqing Surface Engineering Association 

 Chongqing Surface Engineering Technology Society 

 Wise Exhibition (Guangdong) Co.,Ltd. 

 Chongqing Painting Industry Association 

 

 Chongqing Electroplating Industry Association 

 Sichuan Province Surface Engineering Industry Association

 Electroplating Industry Association of Hunan Province


USA Powder Coating Institute


Singapore Surface Engineering Association


Metal Finishers' Association of India


Brazilian Surface Finishing Association

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